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Automatic Lab Tube Furnace Enhanced Chemical Vapor Deposition Furnace

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Automatic Lab Tube Furnace Enhanced Chemical Vapor Deposition Furnace

Name: Automatic Lab Tube Furnace Enhanced Chemical Vapor Deposition Furnace
Brand: Brother Furnace
Price: 1 USD

Brand Name : Brother Furnace

Model Number : BR-PECVD

Certification : CE

Place of Origin : China

MOQ : 1 Set

Price : Negotiation

Payment Terms : L/C, T/T, Western Union

Supply Ability : 200 Sets per month

Delivery Time : 7-21 Working days

Packaging Details : Strong wooden box for global shipping

Max Temperature : 1200℃

Normal vacuum : -0.1MPa

Max Vacuum : Configuration molecular pump, Vacuum 7x10-4 Pa (Optional)

Flange : 304 stainless steel sealing flange

Over-temperature protection : automatic power-off when the temperature exceeds the allowable set value

Safety protection : Automatically power off when the furnace body leaks

Furnace structure : double layer steel dual cooling fan, surface temperature below 50℃

Max Heating rate : 20°C /min

TEMPERATURE ACCURACY : ±1℃

TEMPERATURE UNIFORMITY : ±5℃

Temperature Control : 50 Segments programmable and auto control

Furnace tube : Quartz tube

Application : Plasma Enhanced Chemical Vapor Deposition Furnace

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Lab Plasma Enhanced Chemical Vapor Deposition Furnace up to 1200 Degree

Intelligent PECVD Introduction:
PECVD system is designed to decrease the reaction temperature of traditional CVD. It installed RF induction equipment in front of traditional CVD to ionize reacting gas, so the plasma is generated. Plasma's high activity is Reaction is accelerated due to the high activity of plasma. So, this system is called PECVD.
This model is the newest product, it synthesized the advantages of most tube PECVD systems, and added a pre-heating zone in the front of the PECVD system. Tests showed that the deposition speed is quicker, the film quality is better, holes are less, and won't crack. AISO fully automatic intelligent control system is independently designed by our company, it is more convenient to operate and its function is more powerful.
Wide application range: metal film, ceramic film, composite film, the continuous growth of various films. Easy to increase function, can expand plasma cleaning etch and other functions

Main Feature:

High film deposition rate: RF glow technology, greatly increasing the deposition rate of the film, the deposition rate can reach 10Å / S
High area uniformity: Advanced multi-point RF feeding technology, special gas path distribution, and heating technology, etc., make the film uniformity index reach 8%
High consistency: using the advanced design concept of the semiconductor industry, the deviation between the substrates of one deposition is less than 2%
High process stability: Highly stable equipment ensures a continuous and stable process

Automatic Lab Tube Furnace Enhanced Chemical Vapor Deposition Furnace

Standard Spares:

Plugging tube 4 pcs
Furnace tube 1 pc
Vacuum pump 1 pc
Vacuum sealing flange 2 sets
Vacuum gauge 1 pc
Gas delivery & vacuum pump
RF plasma equipment

Optional Spares:

Quick release flange, Three-way flange
7 inch HD touch scree

Plasma Enhanced Chemical Vapor Deposition Furnace Standard specification:

1. Heating System
Max.temperature	1200℃ (1 hour)
Working temperature	≤1100℃
Chamber size	Φ100*1650mm (Tube diamater is customizable)
Chamber material	High purity alumina fiber board
Thermocouple	K type
Temperatureaccuracy	±1℃
Temperature control	● 50 programmable segments for precise control of heating rate, cooling rate and dwell time. ● Built in PID Auto-Tune function with overheating & broken thermocouple broken protection. ● PLC automatic control system by PC controller inside. ● The temperature control system, sliding system (Time and Distance) could be controlled by program.
Heating length	440mm
Constant heating length	200mm
Heating element	Resistance wire
Power supply	Single phase, 220V, 50Hz
Rated power	9kW
2. RF Plasma Source
RF frequency		13.56 MHz±0.005%
Output power		500W
Max reflect power		500W
RF output interface		50 Ω, N-type, female
Power stability		±0.1%
Harmonic component		≤-50dbc
Supply voltage/Frequency		Single phase AC220V 50/60HZ
Whole efficiency		>=70%
Power factor		>=90%
Cooling method		Forced air
3. Three precision mass flowmeters control system
External dimension		600x600x650mm
Connector type		Swagelok SS joint
Standard range (N₂₎		0~100sccm, 0~200sccm, or customizable
Accuracy		±1.5%
Linear		±0.5～1.5%
Repeatability		±0.2%
Response time		Gas property: 1～4 Sec; Electrical property: 10 Sec
Pressure range		0.1～0.5 MPa
Max.pressure		3MPa
Interface		Φ6,1/4''
Display		4 digit display
Ambient temperature		5~45 high purity gas
Pressure gauge		－0.1～0.15 MPa, 0.01 MPa/unit
Stop valve		Φ6
Polish SS tube		Φ6
Low vacuum system included

Why Brother's Lab Plasma Enhanced Chemical Vapor Deposition Furnace?

Manufacturer with 10+ years' experience
Best quality
Customized design
Experienced workers
Big factory

Customers from more than 30 countries choose us

Satisfied customers offer proof of our commitment to excellent design, quality and cost efficiency.

Best service, Fast response

Free design for special furnace
Free technical support for the lifetime
Free sample test

If you're interested in our Plasma Enhanced Chemical Vapor Deposition Furnace, contact us now to get a quote!

Product Tags:

rotating tube furnace

quartz tube furnace

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